Get­ting to know In­tel Z170

HWM (Malaysia) - - FEATURE - Ko­hWanzi KenKoh

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Art Di­rec­tion PC en­thu­si­asts can fi­nally breathe a sigh of re­lief. Now that the tedium that was Broad­well is safely out of the way, we can fi­nally fo­cus on the per­for­mance CPU parts that are Sky­lake and In­tel’s new Z170 chipset.

No more half-baked 65-watt parts! New Sky­lake desk­top parts in the form of the Core i7-6700K and Core i5-6500K have al­ready de­buted, with a re­as­sur­ing 91-watt Ther­mal De­sign Power (TDP) that we’d ex­pect of CPUs geared for per­for­mance.

So the CPUs – a cou­ple of them at least – are ready, but what about the chipset? Z170 of­fers sev­eral sig­nif­i­cant im­prove­ments over last year’s Z97, and we’ll take you through the key new fea­tures and their prac­ti­cal im­pli­ca­tions.

In­tel Z170 Chipset Di­a­gram

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