UTeM inks pact with US var­sity

New Straits Times - - News -

ME­LAKA: Univer­siti Teknikal Malaysia Me­laka (UTeM) yes­ter­day an­nounced a ground­break­ing part­ner­ship agree­ment with

In­di­ana Uni­ver­sity-Pur­due Uni­ver­sity In­di­anapo­lis (IUPUI) in the United States, as it gears to­wards pro­duc­ing more tech­ni­cal and vo­ca­tional ed­u­ca­tion and train­ing (TVET) grad­u­ates to meet fu­ture de­mands.

Dur­ing a visit to IUPUI, UTeM chair­man Tan Sri Dr Ah­mad Ta­jud­din Ali for­malised the agree­ment, which es­tab­lishes a frame­work for stu­dents, fac­ul­ties and re­searchers at UTeM and at

IUPUI’s School of En­gi­neer­ing and Tech- nol­ogy to par­tic­i­pate in aca­demic ex- changes and re­search.

The sign­ing cer­e­mony con­cluded a three-day meet­ing in In­di­anapo­lis and Bloom­ing­ton.

“It marks an­other mile­stone for both in­sti­tu­tions in pre­par­ing com­pet­i­tive en­gi­neer­ing and en­gi­neer­ing tech­nol­ogy grad­u­ates for the global work­force,” Ta­jud­din said.

Un­der the agree­ment, the uni­ver­si­ties plan to share cur­ric­ula and de­velop op­por­tu­ni­ties for un­der­grad­u­ate stu­dents in me­chan­i­cal en­gi­neer­ing, me­chan­i­cal en­gi­neer­ing tech­nol­ogy, com­puter en­gi­neer­ing, com­puter en­gi­neer­ing tech­nol­ogy, elec­tri­cal en­gi­neer­ing and elec­tri­cal en­gi­neer­ing tech­nol­ogy.

Tan Sri Dr Ah­mad Ta­jud­din Ali

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