Samsung mulls boosting capacity at China facility
SEOUL: Samsung Electronics Co Ltd said yesterday it is considering adding memory chip production capacity at its manufacturing base in China amid an industry-wide boom.
The firm was considering adding capacity at its facility in Xi’an but no specifics had been decided, said a Samsung spokesman.
Samsung, the world’s No.1 memory chip maker, has already invested US$7 billion (RM29.8 billion) in the Xi’an facility to make 3D NAND memory chips.
The chips are used for highend data storage products on electronic devices such as smartphones, personal computers and data servers.
South Korean media reports said yesterday that Samsung was in advanced talks with the Chinese authorities to add 3D NAND chip capacity in Xi’an, and that construction could begin before the year-end.
Researcher IHS expects this year’s memory industry revenue jump 32 per cent to a record US$104 billion.
Industry executives and analysts say 3D NAND suppliers will likely struggle to keep up with orders this year.