ARM, TSMC partnering on IoT subsystem to boost development of customized chips
UK chip designer ARM Holding Plc teamed up with Taiwan Semiconductor Manufacturing Co. (TSMC, ) Monday at Computex Taipei to unveil a new hardware subsystem that allows fast and efficient development of highly customized chips for smart connected devices. The ARM IoT (Internet of Things,
) subsystem has been developed in collaboration with TSMC, the world’s largest contract chip maker, for production on TSMC’s 55-nanometer UltraLow Power (55ULP) process technology, ARM said at a pre-show press event.
The chips have embedded flash memory, are smaller and cheaper than usual, have low power consumption and run at under one volt, which extends battery life, ARM said.
The ARM subsystem will support the IoT market growth by reducing devel- opment risk and allowing companies to quickly create products for the smart home and smart city markets, the British company said.
The subsystem is likely to be licensed by analog sensor manufacturers and companies seeking to add IoT connectivity to their existing intellectual property, according to ARM.
“With industry expectations of hundreds of billions of new smart connected sensors by 2030, we see a growing demand for highly customized chips,” said James McNiven, general manager of systems and software at ARM.
McNiven said the ARM IoT subsystem, designed specifically for use with the company’s Cortex- M processor architecture, “enables our partners to focus finite design resources on the system functionality that differentiates them in their market.”
Suk Lee, senior director of the de- sign infrastructure marketing division at TSMC, said his company has been working with ARM to ensure that the IoT subsystem is optimized for TSMC’s 55ULP process technology.
“This process is very well suited for smart IoT devices as it provides a fine balance of cost and energy efficiency,” Lee said.
TSMC launched the foundry segment’s first and most comprehensive ULP technology platform in September 2014 to serve a range of applications that support demand for IoT and wearable devices.
More than 60 billion ARM- based chips have been shipped globally by the company’s partners, including over 11 billion chips based on ARM’s Cortex-M architecture designed for the IoT — the trend of connecting more devices to each other and to the Internet.
The media check out the latest innovations at the COMPUTEX TAIPEI press conference in Taipei, yesterday. A totoal of 72 products were recognized in the COMPUTEX d&i awards ceremony at the event. The top honor — the Best Choice Award — will be announced today at the COMPUTEX TAIPEI opening ceremony.