ARM, TSMC part­ner­ing on IoT sub­sys­tem to boost devel­op­ment of cus­tom­ized chips

The China Post - - TAIWAN BUSINESS -

UK chip designer ARM Hold­ing Plc teamed up with Tai­wan Semi­con­duc­tor Man­u­fac­tur­ing Co. (TSMC, ) Mon­day at Com­pu­tex Taipei to un­veil a new hard­ware sub­sys­tem that al­lows fast and ef­fi­cient devel­op­ment of highly cus­tom­ized chips for smart con­nected de­vices. The ARM IoT (In­ter­net of Things,

) sub­sys­tem has been de­vel­oped in col­lab­o­ra­tion with TSMC, the world’s largest con­tract chip maker, for pro­duc­tion on TSMC’s 55-nanome­ter Ul­traLow Power (55ULP) process tech­nol­ogy, ARM said at a pre-show press event.

The chips have em­bed­ded flash mem­ory, are smaller and cheaper than usual, have low power con­sump­tion and run at un­der one volt, which extends bat­tery life, ARM said.

The ARM sub­sys­tem will sup­port the IoT mar­ket growth by re­duc­ing de­vel- op­ment risk and al­low­ing com­pa­nies to quickly cre­ate prod­ucts for the smart home and smart city mar­kets, the Bri­tish com­pany said.

The sub­sys­tem is likely to be li­censed by ana­log sen­sor man­u­fac­tur­ers and com­pa­nies seek­ing to add IoT con­nec­tiv­ity to their ex­ist­ing in­tel­lec­tual prop­erty, ac­cord­ing to ARM.

“With in­dus­try ex­pec­ta­tions of hun­dreds of bil­lions of new smart con­nected sen­sors by 2030, we see a grow­ing de­mand for highly cus­tom­ized chips,” said James McNiven, gen­eral manager of sys­tems and soft­ware at ARM.

McNiven said the ARM IoT sub­sys­tem, de­signed specif­i­cally for use with the com­pany’s Cor­tex- M pro­ces­sor ar­chi­tec­ture, “en­ables our part­ners to fo­cus fi­nite de­sign re­sources on the sys­tem func­tion­al­ity that dif­fer­en­ti­ates them in their mar­ket.”

Suk Lee, se­nior direc­tor of the de- sign in­fra­struc­ture mar­ket­ing di­vi­sion at TSMC, said his com­pany has been work­ing with ARM to en­sure that the IoT sub­sys­tem is op­ti­mized for TSMC’s 55ULP process tech­nol­ogy.

“This process is very well suited for smart IoT de­vices as it pro­vides a fine bal­ance of cost and en­ergy ef­fi­ciency,” Lee said.

TSMC launched the foundry seg­ment’s first and most com­pre­hen­sive ULP tech­nol­ogy plat­form in Septem­ber 2014 to serve a range of ap­pli­ca­tions that sup­port de­mand for IoT and wear­able de­vices.

More than 60 bil­lion ARM- based chips have been shipped glob­ally by the com­pany’s part­ners, in­clud­ing over 11 bil­lion chips based on ARM’s Cor­tex-M ar­chi­tec­ture de­signed for the IoT — the trend of con­nect­ing more de­vices to each other and to the In­ter­net.


The me­dia check out the lat­est in­no­va­tions at the COM­PU­TEX TAIPEI press con­fer­ence in Taipei, yes­ter­day. A to­toal of 72 prod­ucts were rec­og­nized in the COM­PU­TEX d&i awards cer­e­mony at the event. The top honor — the Best Choice Award — will be an­nounced to­day at the COM­PU­TEX TAIPEI open­ing cer­e­mony.

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