ROC No. 1 in world for spend­ing on semi­con­duc­tor man­u­fac­tur­ing

The China Post - - LOCAL -

In 2015, Tai­wan is pro­jected to have the high­est capex for semi­con­duc­tor man­u­fac­tur­ing world­wide, ac­cord­ing to a press re­lease from Semi­con­duc­tor Equip­ment and Ma­te­ri­als In­ter­na­tional (SEMI).

Tai­wan’s ag­gres­sive semi­con­duc­tor fac­tory plans are bring­ing ex­hibitors and at­ten­dees to SEMI­CON Tai­wan 2015 Sept. 2-4 at the Taipei Nan­gang Ex­hi­bi­tion Cen­ter, Hall 1. Over 40,000 visi­tors are ex­pected to at­tend the ex­hi­bi­tion and con­fer­ences. En­ter­ing its 20th year, SEMI­CON Tai­wan con­nects at­ten­dees with the com­pa­nies, peo­ple, prod­ucts, and in­for­ma­tion fa­cil­i­tat­ing the fu­ture for de­sign and man­u­fac­tur­ing for the ad­vanced elec­tron­ics in­dus­tries, SEMI stated.

Ac­cord­ing to SEMI mar­ket re­ports, foundry and DRAM are the two sec­tors of cap­i­tal equip­ment in­vest­ment in Tai­wan, with OSATs’ ad­vance pack­ag­ing fa­cili- ties as a key growth driver. Fab equip­ment spend­ing in Tai­wan is pro­jected to be about NT$10.5 bil­lion in 2015, ap­proach­ing 30 per­cent of the over­all in­dus­try spend­ing on fab equip­ment. Over­all, Tai­wan rep­re­sents 21 per­cent of the in­stalled fab ca­pac­ity glob­ally and 25 per­cent of the in­stalled 300 mil­lime­ter ca­pac­ity.

In 2015 alone, com­pa­nies in Tai­wan are forecast to spend NT$1.5 bil­lion or more on pack­ag­ing and test equip­ment. With the grow­ing im­por­tance of pack­ag­ing and test­ing, SEMI will host the Sil­i­con in Pack­ag­ing ( SiP) Global Sum­mit 2015 from Sept. 3-4. The two-day SiP Global Sum­mit 2015 con­sists of two ma­jor fo­rums: 3D-IC Tech­nol­ogy Fo­rum and Em­bed­ded and Wafer Level Pack­age Tech­nol­ogy Fo­rum.

SEMI­CON Tai­wan cov­ers a wide ar­ray of crit­i­cal is­sues. Busi­ness pro­grams will in­clude the Ex­ec­u­tive Sum­mit, Mar­ket Trends Fo­rum, and CFO and In­vestor Ex­ec­u­tive Sum­mit. Tech­nol­ogy pro­grams in­clude: Semi­con­duc­tor Ma­te­ri­als Fo­rum, Sus­tain­able Man­u­fac­tur­ing Fo­rum, Ad­vanced Pack­ag­ing Tech­nol­ogy Sym­po­sium, TechXPOT, MEMS Fo­rum, High-Tech Fa­cil­ity In­ter­na­tional Fo­rum, eMDC Fo­rum, Ad­vanced Tech­nolo­gies in Ac­cel­er­at­ing Dig­i­tal Era and IoT Fo­rum, Mem­ory Tech­nol­ogy Fo­rum, IC De­sign Sum­mit, and more, SEMI­CON Tai­wan stated.

SEMI­CON Tai­wan also fea­tures: Sup­plier Search Pro­gram and Buy­ers Brief­ing. As al­ways, the event fea­tures a Lead­er­ship Gala din­ner, an elite net­work­ing event and one of the most im­por­tant an­nual ex­ec­u­tive gath­er­ings for the high-tech in­dus­try in Tai­wan.

SEMI Tai­wan hosts SEMI­CON Tai­wan with TAITRA and TSIA as co-or­ga­niz­ers. The event is ad­vised by the Tai­wan Min­istry of Eco­nomic Af­fairs, said SEMI­CON Tai­wan.

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