AMD INTROS ZEN 4 RYZEN 7000 CPUS AND AM5 MOTHERBOARDS

AMD CEO Lisa Su revealed more details about the upcoming Ryzen 7000 series processors and the 600-series motherboards, both of which will arrive in Q3 2022. The company demoed a 16-core Ryzen 7000 processor hitting an amazing 5.5 GHz during a gaming demo, and also completing a Blender render in 31 percent less time than Intel’s flagship Core i9-12900K. As expected, we also learned plenty of new details about the 5nm Zen 4 Ryzen 7000 ‘Raphael’ processors and the new wave of motherboards with the AM5 socket.

AMD claims the Ryzen 7000 processors will have >15 percent more single-threaded performance than their Zen 3 predecessors (not IPC), up to a 5GHz+ maximum boost frequency, come with integrated RDNA 2 graphics (a first), and will support only DDR5 memory. In addition, the chips have 5nm CPU chiplets for the cores, a 6nm I/O die, and twice the L2 cache (1MB) per core.

The Ryzen 7000 processors come with expanded instructions for AI acceleration, but AMD isn’t sharing details yet. AMD has also doubled the L2 cache per core to 1MB for Zen 4, giving the execution cores a heftier slab of near memory for workloads.

AMD splits the

600-series chipsets into a new X670E (Extreme) upper-tier in addition to the standard X670 and

B650 swim lanes. The X670E motherboard will come with full support for PCIe 5.0, while the X670 and B650 will have varying levels of support for PCIe 5.0 or 4.0 (details below). AMD also revealed that the AM5 socket would support up to 170W of peak power, which will be helpful for high core-count models. The RDNA 2 engine also supports up to four display outputs, including HDMI 2.1 and DisplayPort 2 interfaces.

"We also learned plenty of new details about the 5nm Zen 4 Ryzen 7000 ‘Raphael’ processors"