Semicon India Programme

The Semicon India Programme is aimed at strengthening the electronic manufacturing ecosystem in the country. With a Rs.76,000 crore outlay, the programme approved by the Union Cabinet late last year has received five applications for semiconductor and display fabs. With an investment outlay of Rs.153,750 crore the applications involve Vedanta Foxconn JV, IGSS Ventures pte, Singapore and ISMC. The applications extend to 28 nm and 65 nm semiconductor fabs with an expected capacity of 120,000 wafers on a monthly basis. The projected investment stands at USD 13.6 bn. On Display fabs, the projected investment is USD 6.7 bn. SPEL Semiconductor Ltd., HCL, Syrma Technology and Vlenkani Electronics have registered under the semiconductor packaging scheme. Terminus Circuits, Trispace Technologies, and Curie Microelectronics have submitted under the Design Linked Incentive Scheme.