INTERNATIONAL news
Chipmakers to form coalition to establish universal chipset standard
Companies like Intel, Qualcomm, AMD, Arm, Samsung, Taiwan Semiconductor Manufacturing Company (TSMC), along with software companies like Meta, Microsoft, and Google Cloud have begun operations to form a coalition to establish a universal chiplet interconnect express (UCIe) standard. The UCIe 1.0 specification has been ratified to provide a complete standardised die-to-die interconnect with physical layer, protocol stack, software model, and compliance testing to enable end users to easily mix and match chiplet components from a multi-vendor ecosystem for system-on-chip (SoC) construction, including customised SoCs.
Japan imposes chip export sanctions, Samsung suspends shipments to Russia
Considering the ongoing Russia-Ukraine war, Japan has announced that it will impose sanctions on Russia that revolve around semiconductor chip exports and financial institutions. Japan will also impose sanctions on exports to Russian militaryrelated organisations, items on restricted lists based on international agreements, and exports of semiconductors and other general-purpose products to Russia. In similar fashion, Samsung has suspended product shipments to Russia citing “current geopolitical developments.” The products that have been suspended include smartphones, semiconductors, and consumer electronics.
LG pulls the plug on solar panel business
LG Electronics has decided to close their solar panel business. The decision comes as uncertainties in the global solar panel business continue to increase due to a variety of contributing factors, including the intensification of price competition and the rising cost of raw materials. LG’s Business Solutions (BS) Company, which operates the solar panel business, will reorganise its portfolio around the key pillars: information technology (IT) and information sisplay (ID).
UMC to invest $5 billion to build new 22nm chip fab in Singapore
Taiwanese chipmaker United Microelectronics is expanding its manufacturing base as it plans to invest US$5 billion in a new manufacturing facility in Singapore to make 22-nanometer chips. The first phase of the investment would add 30,000 wafers of 30cm (12-inch) dia per month to UMC’s capacity, with production expected to start in 2024.
Arm to reduce workforce following its acquisition deal with Nvidia
Following the fallout of its acquisition deal with Nvidia, UK based chip company Arm Ltd has revealed that it is looking to cut 12 to 15% of its workforce. Most of the job losses would be in the UK and the USA.
Panasonic starts production of new Li-ion battery for Tesla
Panasonic Corp intends to begin mass production of a new lithium-ion battery for Tesla Inc. before the end of March at a plant in Japan. The company will establish a production facility at its Wakayama factory in western Japan to manufacture the new ‘4680’ lithium-ion batteries. Two additional production lines as well as utility facilities will be established at the factory, and productivity verification and mass production are set to begin in the fiscal year ending in March 2024.
Nothing locks $70 million in Series B funding round
Carl Pei-led consumer tech brand Nothing has raised $70 million in a Series B fundraise round. The funding will be used to create new product categories in partnership with Qualcomm Technologies and its Snapdragon platform, and grow operations at its new London Design Hub, led by ex-Dyson Head of Design, Adam Bates.
Analog Devices to invest 100 million euros in Europe operations
Analog Devices will invest 100 million euros over the next three years in ADI Catalyst, a 1000 square metre custom-built facility for innovation and collaboration located at its campus in the Raheen Business Park in Limerick, Ireland. ADI Catalyst is an accelerator where ecosystems of customers, business partners, and suppliers engage with ADI to develop industry-leading solutions.
Kioxia to acquire Chubu Toshiba Engineering
Japanese computer memory maker Kioxia Holdings Corporation has entered into a definitive agreement with Toshiba Digital Solutions Corporation to acquire all the outstanding shares of its subsidiary, Chubu Toshiba Engineering (CTE) Corporation. This acquisition will help Kioxia strengthen its technology development capabilities. CTE is involved in semiconductor manufacturing technologies, specialising in semiconductor related hardware and software design, prototyping and evaluation, covering areas from development to mass production.
Altair expands electronic system design technology
Altair has acquired Powersim, a provider of simulation and design tools for power electronics. This acquisition expands Altair’s electronic system design technology into the domain of power electronics. This acquisition includes PSIM, Powersim’s flagship product for design and simulation of power electronics and motor drives.
Menlo Micro raises money in Series C funding
US based Menlo Micro has raised $150 million in Series C funding from Vertical Venture Partners and Tony Fadell’s Future Shape. Microelectromechanical system switches maker Menlo Micro will use the funding to expand domestic manufacturing and supplychain for the Ideal switch.