INTERNATIONAL news
IFA 2022 in large-scale and real-life
IFA Berlin—the world’s most important trade show for consumer electronics and household appliances—is making a large-scale and real-life return this year, from 2-6 September 2022. Two-thirds of IFA’s top exhibitors have already confirmed their attendance, with a huge number of exhibitors planning to return at the same scale as in 2019, the last IFA year before the pandemic.
Victor sets up a new power modules facility in the US
Opened at 400 Federal Street, Andover, this mobile manufacturing facility enables scalable, automated, cost-effective manufacturing of power modules in the United States. Celebrating 41 years of its global power electronics industry, Vicor’s new facility utilises patented fabrication processes to differentiate Vicor power modules.
20cm SiC wafers being developed by Showa Denko
The New Energy and Industrial Technology Development Organisation (NEDO) has selected Showa Denko’s ‘Project to Develop SiC Wafers Technology for Next-generation Green Power Semiconductors,’ as a candidate for projects to develop 20cm (8-inch) wafers technology for next-generation power semiconductors. The Japanese government aims to achieve carbon neutrality by 2050.
Ligado Networks partners with Sony Semiconductor Israel
Partnering with Sony Semiconductor Israel, Ligado Networks has developed advanced connectivity services across North America, enabling provision of chipsets for standalone satellite and terrestrial connections. The two companies have indicated that the initial technology trials would be taking place by the end of the year.
Partnership between Nexperia and KYOCERA for GaN power modules
Gallium nitride (GaN) devices are manufactured at Nexperia using mature mass production techniques, which have proven to meet the highest reliability requirements for devices to achieve AEC-Q101 certification. KYOCERA AVX Components (Salzburg) GmbH, on other hand, supplies advanced electronic components for the automotive industry. The partnership between both the companies is to focus on power components with the aim of jointly developing GaN applications for electric vehicles.
STMicroelectronics and MACOM successfully produce RF GaN-on-Si prototypes
STMicroelectronics and MACOM Technology Solutions Holdings Inc. have announced successful production of radio-frequency Gallium-Nitride-on Silicon (RF GaN-on-Si) prototypes. RF GaNon-Si offers high potential for 5G and 6G infrastructure. GaN can offer superior RF characteristics and significantly higher output power than LDMOS for these RF PAs. Further, it can be manufactured on either silicon or silicon-carbide (SiC) wafers. The GaNon-Si technology is expected to offer competitive performance paired with large economies of scale, enabled by its integration into standard semiconductor process flows.
Intel investing in mega R&D lab for innovative data centre tech
Intel has unveiled plans to invest more than $700 million in a 20,000sq-m, R&D mega lab focused on innovative data centre technologies. It also introduced the technology industry’s first open intellectual property (open IP) immersion liquid cooling solution and reference design. Construction on the lab will begin this year at the Jones Farm campus in Hillsboro, Oregon, with opening expected in late 2023.
High-voltage fuses with onboard charging protection for EVs from Eaton
Eaton has introduced their EVK series of high-voltage fuses for high-powered electric vehicles. One unique feature is the onboard charging protection. The EV fuses from Eaton meet the requirement of current ratings up to 1000V DC and 600A. They are also able to dissipate the heat appropriately from such areas that are prone to overheating and related damages.
dRISK to build the ultimate test for self-driving cars
dRISK’s statistical robustness and auditability has allowed it to win the largest grant from the UK’s Centre for Connected and Autonomous Vehicles, enabling dRISK to build the ultimate test for self-driving cars. The global market for AI training data alone is currently valued at $1.5 billion. FWT’s investment will accelerate the development and growth of dRISK as a central technology for AV development.
EnSilica on London Stock Exchange’s AIM market
Listed on the London Stock Exchange’s AIM market, EnSilica has raised £6 million ($7.4 million) through a placing and subscription of 12 million ordinary shares at a price of 50p per share. It will open with a market capitalisation of £37.6 million ($46.6 million).