Top Fintech expert to address LankaPay Technnovation Awards 2018

The entire banking and finance industry of Sri Lanka will gain valuable insights firsthand this September via an international Fintech expert from Singapore who is slated to deliver the keynote address at LankaPay Technnovation Awards 2018. Chia Hock Lai, Founding President of Singapore Fintech Association (SFA), will speak on the future of the payment industry at this glamorous event on September 20 at the Shangri – La Hotel, Colombo. He will be gracing the second edition of the successful LankaPay Technnovation Awards event as the keynote speaker whereas the Telecommunication, Digital Infrastructure and Foreign Employment Minister Harin Fernando will be the Chief Guest while the Governor of the Central Bank of Sri Lanka, Dr. Indrajit Coomaraswamy, will be the Guest of Honour, a media release from LankaPay said.

Mr. Chia has over two decades of experience in the Fintech industry in addition to his current position as the President of the SFA. He is a Fellow of the Singapore University of Social Science, a member of the Banking and Finance and Fund Industry panel of Nanyang Polytechnic and an advisor to start-up companies.

He is expected to share valuable insights from his vast experience in the financial services industry, challenges faced and the way forward at the Technnovation Awards.

LankaPay Technnovation Awards 2018 is planned to be held in grand style, after a very successful inaugural event last year, under the theme ‘Recognizing Excellence and Convenience’. The event aims to recognise and reward the payment technology innovators who have successfully addressed the emerging lifestyle needs of people by taking customer convenience to new heights.