HUAWEI inspires smartphone industry with world’s first 7nm chipset launch
In his IFA 2018 keynote titled “The Ultimate Power of Mobile AI”, HUAWEI Consumer Business Group CEO Richard Yu introduced the Kirin 980, the system on a chip (SoC) that will bring about the next evolution of mobile AI. As the world’s first commercial SoC manufactured with Taiwan Semiconductor Manufacturer Company’s (TSMC) 7nm process, Kirin 980 combines best-in-class performance, efficiency, connectivity features, and Dual NPU AI processing power.
Commenting on the historic occasion, Richard Yu, the CEO of HUAWEI CBG added, “Last year, we showed the world the potential of On-Device AI with the Kirin 970, and this year, we’ve designed an all-round powerhouse that not only features outstanding AI capabilities, but also brings cutting-edge raw performance to consumers. Equipped with an all-new CPU, GPU and Dual NPU, the Kirin 980 is the ultimate engine to power next-generation productivity and entertainment applications.” Therefore it’s evident that the 10nm Kirin 970 SoC that is powering HUAWEI’s flagship devices will soon cede its “cutting-edge” title to 7nm.
HUAWEI has a stellar track record of leading chipset development. Going back in recent history, while other manufacturers were designing chips for the 20nm process, HUAWEI unveiled the first 16nm chip with Kirin 950. And leading the trends as usual, just within few months of launching their latest model nova3 series, HUAWEI launched Kirin 980, the world’s first commercially available 7nm chipset.