The Sun (Malaysia)

Unisem halts Chengdu ops on coronaviru­s concerns

O Plant closure to last from Feb 2 to 9, on the directive of Chinese city’s authoritie­s

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PETALING JAYA: Unisem (M) Bhd has become the first Malaysian manufactur­er to order a halt to its operations in China over concerns on the spread of the coronaviru­s.

In a Bursa Malaysia filing, the group said its subsidiary Unisem Chengdu Co Ltd has stopped all operations at its plant on the directive of local authoritie­s.

“[The closure runs] beginning Feb 2 to Feb 9. This is part of the measures taken to contain the coronaviru­s,” it said.

The impact from the suspension of its Chengdu operation remains to be seen.

According to the group’s FY18 annual report, Unisem’s Asian operations contribute­d 36.5% or RM492.96 million in revenue, 17.4% lower than its contributi­on of RM596.59 million in FY17.

Unisem Chengdu, employing 2,000 people, started operations in 2006 and provides full turnkey solutions; packaging capability, leadless packages, modules, microelect­romechanic­al systems, wafer level chip scale package and flip chips.

For the third quarter ended Sept 30, Unisem reported first quarterly losses since FY13 with a net loss of RM3.2 million, from a net profit of RM35.15 million in the previous correspond­ing quarter on trade conflicts leading to supply chain realignmen­t and sustained weakness in its automotive segment.

There were also one-off adjustment­s made including terminatio­n benefits for the group’s Indonesian operations, deferred tax, forex gain, inventory provision and grant income.

Its revenue also fell 10.8% to RM316.3 million from RM354.7 million a year before on lower sales volume.

On Bursa Malaysia yesterday, Unisem shares closed 4 sen lower at RM2.18, with 31,300 shares done. It has declined 13.1% from its recent peak of RM2.51.

 ?? – UNISEM WEBSITE ?? Unisem Chengdu provides full turnkey solutions which include packaging capability, leadless packages, modules, microelect­romechanic­al systems, wafer level chip scale package and flip chips.
– UNISEM WEBSITE Unisem Chengdu provides full turnkey solutions which include packaging capability, leadless packages, modules, microelect­romechanic­al systems, wafer level chip scale package and flip chips.

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